Please download and consult the following Novacam application notes:


μCam-3D profilometer is used for::
Applications in the semiconductor and electronics industry:
Non contact measurements of:
- Ball position
- Ball height
- Missing ball
- Warpage of the package
- Laser etch depth
- Lead co-planarity of QFP packages

Non contact measurements of thick film
 - Wet and soft print layers
- Solder paste volume
- Layer thickness
- Substrate roughness
- Glue dot dimensions

BGA chip
 - Top view - height encoded by brightness

 
  3D measurements of the Flip-Chip package
 
 

 

 

 

Aerospace applications

Rivet
- scanned with 10um sampling

Rivet and holes 

 

3D Surface inspection

3D Surface inspection of a two dollar coin (Toonie)

 

Surface Inspection of casting parts

Typical setup with x-y table.

The acquisition is done from a distance of 150mm (6"). Still precise measurements of under 1µm (1/25mil) are obtained.

The probe is connected to the detector housing with the optic fiber. The detector's enclosure can be can be located far from the measurement site.

Other probes are available. 
image of the drag surface of the star test cast pattern and part of scanned 3D mapped surface (grey color represent height - brighter is higher)
image of the cope surface of the star test cast pattern and part of scanned 3D mapped surface (grey color represent height - brighter is higher)

 

Internal wall small diameter tube profiling

Plasma torch wear inspection (courtesy of NRC)

- A similar application is the 3D gun barrel mapping for forensic applications

 



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